Paste Content: Alloy Tin 42% Bi58%, Sloder Flux Content: 10.5%. Wonderway Sn42/Bi58 Tin Lead Free Solder Paste 138℃ Low Point No-Clean Welding Soldering Tin For Electronics PCB IC CELLPHONE CPU LED BGA Repairing (20g).
Lead-Free Solder Paste Sn42/Bi58 T4, No Clean, 138℃ Melting Point, 30g
Paste Content: Alloy Tin 42% Bi58, Sloder Flux Content: 10.5%.
Sn42/bi58 T4 Lead Free Solder Paste No Clean 138โ Melting Point 20g
Paste Content: Alloy Tin 42% Bi58%, Sloder Flux Content: 10.5%. Sn42/Bi58 Tin Lead Free Solder Paste 138℃ Low Point No-Clean Welding Soldering Tin For Electronics PCB IC CELLPHONE CPU LED BGA Repairing (20g).
Wonderway Sn42/Bi58 T4 Lead Free Solder Paste No Clean, 138 Melting Point (30g)
Sn42/Bi58 Tin Lead Free Solder Paste 138℃ Melting Point No-Clean Welding Soldering Tin For Electronics PCB IC CELLPHONE CPU LED BGA Repairing (30g) Paste Content: Alloy Tin 42% Bi58, Sloder Flux Content: 10.5% Product Parameters: Total Weight: 39g, Net Weight Of Paste: 30g Paste Features: No Clean, Strong Viscosity, Bright Welding Point Product Advantages: Pushing design for Smoother Flowing, No Waste During Welding Applications: Widely Used In Circuit Board, IC, Phone, TV and Other Household Appliances and Industrial Equipment
Wonderway Sn42/Bi58 T4 Lead Free Solder Paste No Clean, 138 Melting Point (30g)
Sn42/Bi58 Tin Lead Free Solder Paste 138℃ Melting Point No-Clean Welding Soldering Tin For Electronics PCB IC CELLPHONE CPU LED BGA Repairing (30g) Paste Content: Alloy Tin 42% Bi58, Sloder Flux Content: 10.5% Product Parameters: Total Weight: 39g, Net Weight Of Paste: 30g Paste Features: No Clean, Strong Viscosity, Bright Welding Point Product Advantages: Pushing design for Smoother Flowing, No Waste During Welding Applications: Widely Used In Circuit Board, IC, Phone, TV and Other Household Appliances and Industrial Equipment
Sn42/Bi58 T4 Lead Free Solder Paste No Clean, 138℃ Melting Point (20g)
Sn42/Bi58 Tin Lead Free Solder Paste 138℃ Low Point No-Clean Welding Soldering Tin For Electronics PCB IC CELLPHONE CPU LED BGA Repairing (20g) Paste Content: Alloy Tin 42% Bi58% , Sloder Flux Content: 10.5% Product Parameters: Total Weight: 29g, Net Weight Of Paste: 20g Paste Features: No Clean, Strong Viscosity, Bright Welding Point Product Advantages: Pushing design for Smoother Flowing, No Waste During Welding Applications: Widely Used In Circuit Board, IC, Phone, TV and Other Household Appliances and Industrial Equipment